Semiconductor Die Attach

A flawless bond between the semiconductor chip and substrate is essential in any microelectronic package. Reltronix combines precision semiconductor die attach with rigorous in-house mechanical qualification, such as die shear and hermeticity testing, to guarantee structural integrity under extreme operating conditions. Designed to meet demanding specifications like MIL-STD-883, our flexible assembly solutions accommodate bare die with custom assembly solutions and packaging.

Core Die Attach Capabilities

• Epoxy Die Attach
  Fully automated, high-repeatability dispensing of industry-standard qualified conductive (e.g., silver-filled) and non-conductive epoxies, with strict process controls.
• Eutectic Die Attach
  High-thermal-conductivity metallic bonding using Gold-Tin (AuSn) and custom alloys, available with or without pre-forms, utilising precision scrubbing techniques for minimal voiding and maximum joint integrity.
• Heat Spreader & Substrate Attach
  Specialised mounting of bare silicon or compound semiconductor die onto specialised carriers and high-thermal-expansion-matched materials, such as Molybdenum (Moly) tabs, copper-tungsten, or ceramic carriers.

Quality Control & Verification

• In-House UK Cleanroom Processing
  Complete quality control, full traceability, and secure handling of sensitive die.
• Strict Process Verification
  Acoustic microscopy, X-ray inspection for void analysis, and non-destructive or destructive die shear testing compliant with MIL-STD-883 standards.
• Substrate & Material Versatility
  Equipped to handle customer-supplied leadframes, custom ceramic packages, metal cans, and customer-provided substrates.

Complete Microelectronic Assembly Flow

Once the die attach process is completed and inspected, assemblies can seamlessly transition to our in-house precision wire bonding services for gold, aluminium, or ribbon interconnects, followed by final package sealing and electrical testing.