Semiconductor Packaging & Assembly Services
Reltronix provides complete, in-house semiconductor packaging, assembly and testing for a wide range of high-reliability (Hi-Rel) semiconductor package types, all within our UK facility.
Whether you need industry-standard solutions or bespoke designs, our microelectronic packaging capabilities ensure environmental protection, thermal management, and long-term device performance.
Supported Semiconductor Package Types
Reltronix assembles and tests the below semiconductor package types all in-house at our UK facility, ensuring strict quality control and traceability.
Industry-Standard Ceramic Packages
Available in both hermetic and non-hermetic configurations.
Industry-Standard Metal Packages
Available in both hermetic and non-hermetic configurations.
Custom Ceramic Packages
Tailored solutions engineered for hermetic and non-hermetic Hi-Rel applications.
Custom Metal Packages
Bespoke metallic packages built for robust hermetic or non-hermetic protection.
Reltronix do not manufacture hybrid circuits or substrates (such as LTCC, thin film, or thick film). We focus purely on packaging, assembly, and test.
Sales & Support
Sub-Contract Assembly Services
In addition to full package turn-key solutions, we offer our semiconductor assembly services on a sub-contract basis. Customers can utilise individual processes or combine multiple services depending on project requirements:
Die Attach Services
Epoxy Die Attach: Using all industry-standard dispensing and qualified materials.
Eutectic Die Attach: Both with or without pre-forms.
Heat Spreader Attach: Specialist die attach onto substrates such as molybdenum (Moly) tabs.
Wire Bonding Services
Precision Gold (Au) ball bonding, Gold wedge bonding, Aluminium (Al) wedge bonding, and Ribbon bonding.
Stud Bumping / Gold Bump Bonding
Advanced bumping for flip-chip attach.
Chip-On-Board (COB) Assembly
Direct chip-on-board wirebonding and protective glob-top encapsulation.
Ready to Discuss Your Packaging Requirements?
Whether you need complete custom packaging, outsourced assembly, or specific sub-contract processes, our UK engineering team is ready to assist.