Semiconductor Die Wire Bonding

High-reliability microelectronics depend on clean, accurate die-level interconnects. Reltronix provides specialised semiconductor die wire bonding services built to satisfy stringent military and high-reliability specifications, including MIL-STD-883.

Our in-house assembly cleanroom offers interconnect solutions ranging from fine-pitch Gold ball bonding and temperature-sensitive Gold wedge bonding to fine or heavy Aluminium wedge bonding and high-frequency Ribbon bonding. By pairing strict process controls with destructive and non-destructive pull testing, we ensure long-term interconnect reliability across all ceramic, metal, and custom packages.

Die Bonding Capabilities

• Epoxy Die Attach
  Automated dispensing of conductive (silver-filled) and non-conductive epoxies, with controlled fillet formation and targeted bond-line thickness (BLT).
• Eutectic Die Attach
  High-thermal-conductivity metallic bonding using Gold-Tin (AuSn) and custom alloys, available with or without pre-forms, utilising precision scrubbing techniques for minimal voiding and maximum joint integrity.
• Heat Spreader & Substrate Attach
  Mounting of bare silicon or compound semiconductor die onto specialised carriers and high-thermal-expansion-matched materials, such as Molybdenum (Moly) tabs, copper-tungsten, or ceramic carriers.

Precision Wire Bonding

Demonstrating wire placement on our in-house wire bonder.

Key Advantages & Quality Controls

• In-House UK Cleanroom Processing
  Complete quality control, traceability, and secure handling of sensitive die.
• Strict Process Verification
  Non-destructive acoustic microscopy, X-ray inspection, and die shear testing compliant with MIL-STD-883 standards.
• Substrate & Material Versatility
  Equipped to handle customer-supplied leadframes, custom ceramic packages, metal cans, and PCB substrates.

Quality Assurance & Bond Strength Verification

To guarantee long-term mechanical integrity and electrical performance under harsh operating conditions, all wire bonding processes are subject to rigorous quality control. We perform destructive and non-destructive bond pull testing to evaluate bond strength, loop profile, and failure modes in accordance with MIL-STD-883 standards.

Learn more about our specialised wire bond pull testing capabilities and mechanical test standards.