Semiconductor Die Wire Bonding

Achieving uncompromising electrical performance and mechanical integrity starts with precision die-level interconnects. Reltronix provides specialised semiconductor die wire bonding services built to satisfy stringent military and high-reliability specifications, including MIL-STD-883.

Our in-house assembly cleanroom is equipped for versatile microelectronic interconnect solutions ranging from fine-pitch Gold ball bonding and temperature-sensitive Gold wedge bonding to fine or heavy Aluminium wedge bonding and high-frequency Ribbon bonding. By pairing strict process controls with destructive and non-destructive pull testing, we ensure long-term interconnect reliability across all ceramic, metal, and custom packages.